A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

Exploring the Utilization of PHC Pile Waste Concrete as Filler in Asphalt Mastics

Using solid waste to replace limestone filler in asphalt concrete can not only reduce the cost of road construction, but also improve the utilization rate of solid waste. In this study, PHC pile waste concrete (PPWC) was innovatively used to replace limestone filler in asphalt mixture and its effect on the physical and rheological properties...

Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag

Aimed to address the low utilization rate of steel slag (SS) and its challenge in resource utilization in China, this study developed ternary geopolymers made by high-content (50%) SS together with fly ash (FA) and granulated blast furnace slag (GBFS). The effects of GBFS content (0–40%) and curing methods (water curing, standard curing,...

Road performance evaluation of prestressed high-strength concrete pile waste powder as alternative filler in asphalt concrete

As a kind of solid waste, using Prestressed High-Strength Concrete Pile Waste Concrete (PPWC) as the replacement for limestone filler in asphalt concrete can not only reduce the accumulation of PPWC and increase its utilization but also avoid the increased road construction costs and environmental degradation associated with limestone mining....

Double-sided numerical thermal modeling of fan-out panel-level MOSFET power modules

Double-sided packages for heat dissipation are an efficient thermal management mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as one of the double-sided forms, exhibits excellent electro–thermal characteristics and provides low stray inductance and thermal resistance. Besides, the temperature at each point...

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...

Spatial-temporal potential exposure risk analytics and urban sustainability impacts related to COVID-19 mitigation: A perspective from car mobility behaviour

Coronavirus disease-2019 (COVID-19) poses a significant threat to the population and urban sustainability worldwide. The surge mitigation is complicated and associates many factors, including the pandemic status, policy, socioeconomics and resident behaviours. Modelling and analytics with spatial-temporal big urban data are required to assist...

Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanical strength, thermal stability, and...