Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...

Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network

Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...

A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation

SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...

Engaging consumers in reusable packaging systems: An exploration of factors influencing the adoption

Reusable packaging systems (RPSs) show promise in replacing single-use packages by extending the packaging lifetime and significantly reducing waste. Yet, knowledge about consumer behaviour in the adoption of RPSs is scarce. We present in-depth insights into how consumers perceive RPSs as a new shopping pattern for fast-moving consumer goods ...

Switching to reuse? An exploration of consumers’ perceptions and behaviour towards reusable packaging systems

Reusable packaging systems (RPSs) can significantly reduce single-use packaging waste. However, knowledge about consumers’ adoption of this kind of packaging is scarce. We adopted a qualitative approach using in-depth interviews with consumers (n = 27) who had actually used an RPS and follow-up phone interviews to capture consumer behaviour...

Milk, mylk or drink: Do packaging cues affect consumers’ understanding of plant-based products?

The market growth of plant-based alternatives to animal food products pushes agencies around the world to discuss specific regulations regarding their communication, terminology, and packaging design. We created and tested 18 packages of plant-based milk and plant-based chicken meat varying the “animalness” of terminology, container, image,...

Copper Nanoparticle Sintering Enabled Hermetic Packaging With Fine Sealing Ring for MEMS Application

Driving by the increased demand for hermetic packaging in the more than Moore (MtM) roadmap, a Cu nanoparticle sintering-enabled hermetic sealing solution was developed with a small-size sealing ring. The developed technology simplifies microfabrication and requires less surface roughness using a sinterable Cu nanoparticle paste. A 50μm size...

An exploratory study using graphic design to communicate consumer benefits on food packaging

Commercial food packages may contain multiple messages. Packaging designers try to integrate all messages into a coherent design. Designers may use text, images or stylistic features, but these mediums may differ in their suitability to communicate specific product benefits. To evaluate the usefulness and effectiveness of these three mediums,...

Conveying information through food packaging: A literature review comparing legislation with consumer perception

Although governments have implemented regulations to inform consumers on important product properties and protect consumers from deceptive information, empirical research on how consumers perceive, interpret and experience food packages have shown frequently that consumers may be misled by how information is presented and packages are...

A 0.12mm² Wien-Bridge Temperature Sensor with 0.1°C (3σ) Inaccuracy from -40°C to 180°C

Resistor-based temperature sensors can achieve much higher resolution and energy efficiency than conventional BJT-based sensors [1], but they typically occupy more area (> 0.25 mm ² ) and have lower operating temperatures (le 125 {circ} {C}) [2]-[4]. This work describes a 0.12mm ² resistor-based sensor that uses a...

Designing for Packaging Sustainability: The Effects of Appearance and a Better Eco-Label on Consumers Evaluations and Choice

The environmental burden of packaging is huge. However, redesigning packaging to make it more sustainable without damaging its other functions is not always easy and can have a negative impact on consumers’ choice. In this paper, we adopt a user-perspective and test the effects of packaging appearance and a better eco-label on consumers’...

A multiwell plate Organ-on-Chip (OOC) device for in-vitro cell culture stimulation and monitoring

This work presents the first multi-well plate that allows for simultaneous mechanical stimulation and electrical monitoring of multiple in-vitro cell cultures in parallel. Each well of the plate is equipped with an Organ-on-Chip (OOC) device consisting of a stretchable micro-electrode array (MEA). For the first time, a film assisted molding ...