- Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips
- Effects of GBFS content and curing methods on the working performance and microstructure of ternary geopolymers based on high-content steel slag
- Road performance evaluation of prestressed high-strength concrete pile waste powder as alternative filler in asphalt concrete
- A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
- Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
- Dynamic mechanical analysis of (Ca,Sr)AlSiN3: Eu2+ phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition
- High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
- Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging