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Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material
Effect of Atmospheric Pressure Plasma Modification on Polyimide and Adhesive Joining with Titanium
Durability of polyimide to titanium bonds
Moisture absorption analysis of high performance polyimide adhesive
Atmospheric pressure plasma surface modification of titanium for high temperature adhesive bonding
Surface modification of polyimide by atmospheric pressure plasma for adhesive bonding with titanium and its application to aviation and space
Effect of chain flexibility in the network structure on the viscoelasticity of epoxy thermosets
Surface Modification of Titanium by Atmospheric Pressure Plasma Treatment for Adhesive Bonding and Its Application to Aviation and Space
Ultra-Thin Deformable Silicon Substrates with Lateral Segmentation and Flexible Metal Interconnect
Kinetic Characterisation of Molding Compounds
Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer
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