Multi Physics Simulation of Wafer Bonding with Nano Copper Paste

The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...

Prediction of the chemical shrinkage of Portland cement

Chemical shrinkage is one of the main reasons leading to the early age deformation of concrete. Hence, the prediction of chemical shrinkage is an important issue for evaluating the deformation of concrete and its influence on the durability of concrete structures. There is still room to improve the accuracy for predicting the chemical shrinkage...

Evaluation of the LDPM elastic and fracture parameters by up-scaling procedure

The heterogeneity of the concrete may be considered on different size scales of observation, ranging from the atomistic scale (10-10m), characterized by the behavior of crystalline particles of hydrated Portland cement, to the macroscopic scale (101 m), where concrete has traditionally been considered homogeneous. The multiscale framework we are...