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A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound
Implementation of Fully Coupled Electromigration Theory in COMSOL
Implementation of General Coupling Model of Electromigration in ANSYS
Graphene based piezoresistive pressure sensor
X-ray investigation of buried SiGe islands for devices with strain-enhanced mobility
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