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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...journal article 2023
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Huang, Luyao (author), Chang, Weiwei (author), Zhang, Dawei (author), Huang, Ye (author), Li, Z. (author), Lou, Yuntian (author), Qian, Hongchang (author), Jiang, Chengying (author), Li, Xiaogang (author), Mol, J.M.C. (author)The influence of outward extracellular electron transfer (EET) of Pseudomonas aeruginosa in accelerating corrosion of 304 stainless steel was investigated. With less NO<sub>3</sub><sup>−</sup> available as electron acceptor, P. aeruginosa biofilm accelerated the pitting corrosion. The ICP-MS and XPS results indicated that P. aeruginosa...journal article 2022
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Fan, Jiajie (author), Qian, Yichen (author), Chen, Wei (author), Jiang, Jing (author), Tang, Zhuorui (author), Fan, Xuejun (author), Zhang, Kouchi (author)A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via interconnection reduces the size, thermal resistance, and parasitic inductance of power module packaging. In this study, the effect of the RDL via size on the reliability of a FOPLP SiC MOSFET power module was investigated. To improve the thermal management...conference paper 2022