Searched for: +
(1 - 14 of 14)
document
Wang, S. (author), Zong, Qihang (author), Yang, Huiru (author), Huang, Qianming (author), Ye, Huaiyu (author), French, P.J. (author)
In recent years, flexible strain sensors based on metal cracks have garnered significant interest for their exceptional sensitivity. However, striking a balance between sensitivity and detection range remains a significant challenge, which often limits its wider application. Herein, we introduce an innovative laser transmission pyrolysis...
conference paper 2024
document
Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)
The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...
conference paper 2024
document
Ye, Hanting (author), Xiong, Jie (author), Wang, Q. (author)
While radio communication still dominates in 5G, light and radios are expected to complement each other in the coming 6G networks. Visible Light Communication (VLC) is therefore attracting a tremendous amount of attention from both academia and industry. Recent studies showed that the front camera of pervasive smartphones is an ideal...
conference paper 2023
document
Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)
Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...
conference paper 2023
document
Wang, S. (author), Tan, Yanlong (author), Liu, Xu (author), Li, Shizhen (author), Liu, Ke (author), Yuan, Wucheng (author), Li, Tao (author), Zhang, Kouchi (author), French, P.J. (author), Ye, Huaiyu (author), Tan, Chunjian (author)
In this article, the avalanche withstand capability and transient failure model of commercial 1200 V asymmetric trench gate SiC MOSFETs are investigated by experiment and simulation under single-pulse unclamped inductive switching (UIS) conditions. The limiting avalanche current and limiting avalanche energy of the device are determined by...
conference paper 2023
document
Tan, C. (author), Wang, S. (author), Liu, X. (author), Jiang, Jing (author), Zhang, Kouchi (author), Ye, H. (author)
On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...
conference paper 2022
document
Liu, Ke (author), Yuan, Wucheng (author), Wang, S. (author), Tan, C. (author), Ye, H. (author)
In this paper, a novel bubble-shift super junction (SJ) MOSFET structure is proposed, and its main static electrical parameters and reverse recovery characteristics are simulated by TCAD software tool. By designing the P-pillar ion implantation windows with a certain offset, the bubble-shift SJ-MOSFET contains a curved pillar region in the upper...
conference paper 2022
document
Yuan, Wucheng (author), Liu, Ke (author), Wang, S. (author), Tan, C. (author), Ye, H. (author)
The limitation of Silicon based power MOSFET was broken by the super-junction (SJ) structure, which can provide lower specific on-resistance and higher breakdown voltage compared with the conventional power MOSFET structure. Multi-epitaxial and multi-ion-implant technology, as a mature manufacturing process of the SJ structure, has been widely...
conference paper 2022
document
Li, Shizhen (author), Liu, X. (author), Fan, Jiajie (author), Tan, C. (author), Wang, S. (author), Xie, Bin (author), Ye, H. (author)
The wide-bandgap semiconductors represented by GaN have a broad application prospect because of their high service temperature and high switch frequency. Quad-Flat-No-Lead (QFN) Package is currently one of the mainstream packaging methods due to its low cost and high efficiency. However, the low reliability of QFN used in GaN devices is still...
conference paper 2022
document
Wang, Wei (author), Zhang, Shizhe (author), Ye, G. (author), Noguchi, Takafumi (author)
Alkali activated materials (AAMs) have received worldwide attention due to its lower embodied energy and environmental impact than that of traditional cementitious materials. However, the activators with high alkalinity may raise the risk of alkali silica reaction (ASR) induced deterioration when reactive aggregates are used, which thereby...
conference paper 2021
document
Liu, Hao (author), Ye, Hanting (author), Yang, J. (author), Wang, Q. (author)
Motivated by the trend of realizing full screens on devices such as smartphones, in this work we propose through-screen sensing with visible light for the application of fingertip air-writing. The system can recognize handwritten digits with under-screen photodiodes as the receiver. The key idea is to recognize the weak light reflected by the...
conference paper 2021
document
Ye, Hanting (author), Wang, Q. (author)
We are now witnessing a trend of realizing full-screen on electronic devices such as smartphones to maximize their screen-to-body ratio for a better user experience. Thus the bezel/narrow-bezel on today's devices to host various line-of-sight sensors would disappear. This trend not only is forcing sensors like the front cameras to be placed...
conference paper 2021
document
Liu, Dong (author), Hasanov, Urfan (author), Ye, Changqing (author), Gou, Xiaofan (author), Wang, X. (author)
Compared with partially superconducting generators, fully superconducting generators (F-SCGs) can further increase the torque density in large direct-drive wind turbine applications. Design trends of F-SCGs intend to increase the electrical loading by applying superconducting wires and boost the current density in the armature winding to meet...
conference paper 2020
document
Hu, Z. (author), Stive, M.J.F. (author), Zitman, T.J. (author), Ye, Q.H. (author), Wang, Z.B. (author), Luijendijk, A. (author), Gong, Z. (author), Suzuki, T. (author)
Salt marshes are distributed along more than 400 km of the Jiangsu coast in Eastern China, which are regarded as important habitats and serve as coastal protection as well. Previous research has proven that salt-marsh vegetation can reduce current velocity and dampen waves by its stems and leaves. Reversely, hydrodynamic forces also have a...
conference paper 2011
Searched for: +
(1 - 14 of 14)