Electron-Irradiation-Induced Degradation of Transfer Characteristics in Super-Junction VDMOSFET

High electric-field stress is an effective solution to the recovery of irradiated devices. In this paper, the dependence of the recovery level on the magnitude of gate voltage and duration is investigated. Compared with the scheme of high gate-bias voltage with a short stress time, the transfer characteristics are significantly recovered by...

High-Voltage and High-Current IGBT Press-pack Module for Power Grid

On the basis of the development and application requirements of flexible DC transmission techniques, a 1 kA/10 kV half-bridge IGBT press-pack module is studied. The module is composed of three subunits in series, and each subunit consists of IGBT chips in parallel. In order to solve the problem of chips failure caused by non-uniform rigid...

Effects of shell thickness on the thermal stability of Cu-Ag core-shell nanoparticles: A molecular dynamics study

Cu-Ag core-shell (CS) nanoparticle (NP) is considered as a cost-effective alternative material to nano silver sintering material in die attachment application. To further reduce the cost, the thickness of the Ag shell can be adjusted. Whereas the shell thickness will also affect the thermal stability of the Cu-Ag CSNPs. In this study, molecular...

Power-Efficiency Evolution of Capacitive Sensor Interfaces

Recent years have witnessed an improvement in the energy efficiency of capacitive sensor interfaces by more than three orders of magnitude. This article reviews the architectural and circuit innovations that have contributed to this progress. The fundamental limit on the energy consumption of capacitive sensor interfaces is discussed, as well...