Searched for: +
(1 - 4 of 4)
document
Dukai, B. (author), Peters, R.Y. (author), Wu, T. (author), Commandeur, T.J.F. (author), Ledoux, H. (author), Baving, T. (author), Post, M. (author), van Altena, V.P. (author), Van Hinsbergh, W. (author), Stoter, J.E. (author)
As in many countries, in The Netherlands governmental organisations are acquiring 3D city models to support their public tasks. However, this is still being done within individual organisation, resulting in differences in 3D city models within one country and sometimes covering the same area: i.e. differences in data structure, height...
journal article 2020
document
Tichem, M. (author), Peters, T.J. (author), Wu, K. (author)
Recent decades have seen impressive developments in the field of integrated<br/>photonics. Chips with complex photonic functionality can presently be designed<br/>and fabricated. Photonic packages consist of one or more PICs, as well as other<br/>(micro-optical) components, and a fibre (array) to establish the external optical<br/>interface. A...
journal article 2018
document
Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
document
Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016
Searched for: +
(1 - 4 of 4)