document

3D interconnect technology based on low temperature copper nanoparticle sintering

Zhang, B. (author), Carisey, Y.C.P. (author), Damian, A. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author)

We explore a methodology for patterned copper nanoparticle paste for 3D interconnect applications in wafer to wafer (W2W) bonding. A novel fine pitch thermal compression bonding process (sintering) with coated copper nanoparticle paste was developed. Most of the particle size is between 10-30 nm. Lithographically defined stencil printing using...

conference paper 2016

document

Output blue light evaluation for phosphor based smart white LED wafer level packages

Koladouz Esfahani, Z. (author), Rostamian, Ali (author), Kolahdouz, Mohammadreza (author), Ma, Teng (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)

This study presents a blue light detector for evaluating the output light of phosphor based white LED package. It is composed of a silicon stripe-shaped photodiode designed and implemented in a 2 μm BiCMOS process which can be used for wafer level integration of different passive and active devices all in just 5 lithography steps. The final...

journal article 2016

document

Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

Koladouz Esfahani, Z. (author), Tohidian, M. (author), van Zeijl, H.W. (author), Kolahdouz, Mohammadreza (author), Zhang, Kouchi (author)

Given the performance decay of high-power light-emitting diode (LED) chips over time and package condition changes, having a reliable output light for sensitive applications is a point of concern. In this study, a light feedback control circuit, including blue-selective photodiodes, for blue/ultraviolet (UV) LED, has been designed and...

journal article 2017

document

High aspect ratio spiral resonators for process variation investigation and MEMS applications

Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)

In this work a method is described to investigate process variations across a wafer. Through wafer MEMS spiral resonators were designed, simulated, fabricated and characterized by measuring the eigenfrequency and corresponding mode shapes. Measuring the eigenfrequency and resulting spectral behavior of resonators on different locations on the...

conference paper 2017

document

Designing a 100 [aF/nm] capacitive transducer

Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Wei, J. (author), Zhang, Kouchi (author), van Driel, W.D. (author)

The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...

conference paper 2018

document

Non-linear bulk micromachined accelerometer for high sensitivity applications

Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author), Wei, J. (author)

This work describes the design, modelling and realisation of the mechanical part of a non-linear MEMS accelerometer intended for large displacement behaviour. For this, a mass/spring system was designed with an extremely low resonance frequency. In this work the mechanical behaviour was verified by measurements done using an optical setup,...

conference paper 2018

document

Compressive response of pristine and superconductor coated MWCNT pillars

Mirza Gheytaghi, Amir (author), Vollebregt, S. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)

poster 2019

document

High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

el Mansouri, B. (author), Middelburg, L.M. (author), Poelma, René H. (author), Zhang, Kouchi (author), van Zeijl, H.W. (author), Wei, J. (author), Jiang, H. (author), Vogel, J.G. (author), van Driel, W.D. (author)

Commercially available gravimeters and seismometers can be used for measuring Earth’s acceleration at resolution levels in the order of ng∕Hz (where g represents earth’s gravity) but they are typically high-cost and bulky. In this work the design of a bulk micromachined MEMS device exploiting non-linear buckling behaviour is described, aiming...

journal article 2019

document

MEMS enabled fast time-resolved X-ray diffraction characterization platform for copper nanoparticle sintering in heterogeneous integration applications

Zhang, B. (author), Wei, J. (author), Bottger, A.J. (author), van Zeijl, H.W. (author), Sarro, Pasqualina M (author), Zhang, Kouchi (author)

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...

conference paper 2019

document

Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration

Middelburg, L.M. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Morana, B. (author), Zhang, Kouchi (author)

This work focusses on the design and fabrication of surface micromachined pressure sensors, designed in a modular way for the integration with analog front-end read-out electronics. Polycrystalline 3C silicon carbide (SiC) was used to fabricate free-standing high topography cavities exploiting surface micromaching. The poly-SiC was in-situ...

journal article 2020

document

Wafer Scale Flexible Interconnect Transfer for Hetrogeneous Integration

Liu, Pan (author), Li, J. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)

A polymer-based wafer level integration technology suitable for miniaturized and multi-functional systems integration was developed and demonstrated in this work. Wafer scale flexible interconnects were firstly fabricated on one wafer, and then transferred to another wafer. Such transfer process involved wafer bonding and application of...

conference paper 2020

document

In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics

Zhang, B. (author), Damian, A.A. (author), Zijl, Jurrian (author), van Zeijl, H.W. (author), Zhang, Y. (author), Fan, J. (author), Zhang, Kouchi (author)

There is a high demand for the implementation of metallic nanoparticle (NP) sintering technology for die attach in high-power electronics. The performance of this technology is superior to that of the technology involving the use of lead-free solders. Although Cu NP paste is potentially a low-cost material, it faces the challenge of oxidation...

journal article 2021

document

Resistive and CTAT Temperature Sensors in a Silicon Carbide CMOS Technology

Romijn, J. (author), Middelburg, L.M. (author), Vollebregt, S. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)

Accurately sensing the temperature in silicon carbide (power) devices is of great importance to their reliable operation. Here, temperature sensors by resistive and CMOS structures are fabricated and characterized in an open silicon carbide CMOS technology. Over a range of 25-200°C, doped design layers have negative temperature coefficients of...

conference paper 2021

document

Towards a Scalable Sun Position Sensor with Monolithic Integration of the 3d Optics for Miniaturized Satellite Attitude Control

Romijn, J. (author), Vollebregt, S. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Leijtens, Johan (author), Sarro, Pasqualina M (author)

In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with...

conference paper 2021

document

Design and Fabrication of a Multi-Functional Programmable Thermal Test Chip

Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)

This paper focuses on the design and fabrication of a new programmable thermal test chip as a flexible and cost-effective solution for simplification of characterization/prototyping of new packages. The cell-based design format makes the chip fit into any modular array configuration. One unit cell is as small as 4x4 mm2, including 6 individually...

conference paper 2021

document

Surface-micromachined Silicon Carbide Pirani Gauges for Harsh Environments

Mo, J. (author), Middelburg, L.M. (author), Morana, B. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)

The application of pressure sensors in harsh environments is typically hindered by the stability of the material over long periods of time. This work focuses on the design and fabrication of surface micromachined Pirani gauges which are designed to be compatible with state-of-the-art Silicon Carbide CMOS technology. Such an integrated...

journal article 2021

document

Integrated Digital and Analog Circuit Blocks in a Scalable Silicon Carbide CMOS Technology

Romijn, J. (author), Vollebregt, S. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)

The wide bandgap of silicon carbide (SiC) has attracted a large interest over the past years in many research fields, such as power electronics, high operation temperature circuits, harsh environmental sensing, and more. To facilitate research on complex integrated SiC circuits, ensure reproducibility, and cut down cost, the availability of a...

journal article 2022

document

Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip

Yi, H. (author), Öztürk, E. (author), Koelink, Marco (author), Krimmling, Jana (author), Damian, Andrei A. (author), Debski, Wojciech (author), van Zeijl, H.W. (author), Zhang, Kouchi (author), Poelma, René H. (author)

High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system with an on-package antenna array working at 122 GHz is presented. The antenna is placed on top of the molded package and the antenna-to-chip interconnection...

journal article 2022

document

Integrated 64 pixel UV image sensor and readout in a silicon carbide CMOS technology

Romijn, J. (author), Vollebregt, S. (author), Middelburg, L.M. (author), el Mansouri, B. (author), van Zeijl, H.W. (author), May, Alexander (author), Erlbacher, Tobias (author), Leijtens, Johan (author), Zhang, Kouchi (author), Sarro, Pasqualina M (author)

This work demonstrates the first on-chip UV optoelectronic integration in 4H-SiC CMOS, which includes an image sensor with 64 active pixels and a total of 1263 transistors on a 100 mm2 chip. The reported image sensor offers serial digital, analog, and 2-bit ADC outputs and operates at 0.39 Hz with a maximum power consumption of 60 μW, which are...

journal article 2022

document

Low Temperature Sapphire to Silicon Flip Chip Interconnects by Copper Nanoparticle Sintering

Ji, X. (author), van Zeijl, H.W. (author), Romijn, J. (author), van Ginkel, H.J. (author), Liu, X. (author), Zhang, Kouchi (author)

The continuous trend to integrate more multi-functions in a package often involves, Heterogeneous Integration of multi-functional blocks in some kind of 3D stacking. The conventional flip chip for die-on-substrate technology applies solder for integration. However, solder joint integration has the disadvantages of restricting height, reflow...

conference paper 2022