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el Mansouri, B. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Nowadays many applications require optical detection of some sorts, ranging from civil to military fields. Depending on the optical source, each sensing element needs to have distinct properties with the spectral range at the top. Choices such as sensitivity and environment play an equally important role, if not more important. The properties of...book chapter 2020
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Van Der Sluis, Olaf (author), Iwamoto, Nancy (author), Qu, Jianmin (author), Yang, Shaorui (author), Yuan, C.A. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Adhesion and delamination have been pervasive problems hampering the performance and reliability of micro-and nano-electronic devices. In order to understand, predict, and ultimately prevent interface failure in electronic devices, development of accurate, robust, and efficient delamination testing and prediction methods is crucial. Adhesion...book chapter 2018
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Middelburg, L.M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)In the coming decade, the development in the area of More than Moore will certainly take over from Moore’s Law. Sensor development and sensor integration will prevail above lower node development. New packaging solutions will be developed which will fuel the integration of sensors. These developments can still be silicon based but where harsh...book chapter 2020
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Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)In this chapter, degradation mechanisms of optical materials, used in the light-emitting diode (LED)-based products, are explained. This chapter aims at describing the service conditions on the degradation mechanisms of different organic optical materials in LEDs which lead to the color shift of the light output. The contributions of different...book chapter 2022
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Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Lumen depreciation is one of the major failure modes in light-emitting diode (LED) systems. It originates from the degradation of the different components within the system, including the chip, the driver, and the optical materials (i.e., phosphorous layer). The kinetics of degradation in real-life applications is relatively slow, and in most...book chapter 2018
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van Driel, W.D. (author), Yazdan Mehr, M. (author), Fan, X. J. (author), Zhang, Kouchi (author)In the foregoing chapters, the reliability of organic compounds in microelectronics and optoelectronics was discussed. It provided a state of the art in reliability concepts for materials used in electronic products. It also enlightened the direction in reliability concepts for these products. In this chapter, we discuss the outlook where we...book chapter 2022
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Inamdar, A.S. (author), van Soestbergen, Michiel (author), Mavinkurve, Amar (author), van Driel, W.D. (author), Zhang, Kouchi (author)Moulding compounds used for encapsulating electronics typically occupy a large portion of package volume and are most exposed to the external environment. Under harsh conditions such as high temperature, humidity, and mechanical vibrations, constituent materials of electronic components degrade, resulting in a change in their thermal, mechanical...conference paper 2023
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van Driel, W.D. (author), Yazdan Mehr, M. (author), Zhang, Kouchi (author)Solid State Lighting (SSL) technologies and products are gradually pervading into our daily life. An SSL system is composed of a LED engine with a micro-electronics driver(s), integrated in a housing that also provides the optical, sensing and other functions. Knowledge of (system) reliability is crucial for not only the business success of the...conference paper 2014
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Yazdan Mehr, M. (author), Hajipour, Pejman (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Cooremans, Thierry (author), De Buyl, Francois (author), Zhang, Kouchi (author)Adhesive bonding is a key joining technology in many industrial applications, including automotive, aerospace industries, biomedical devices, and microelectronic components. Adhesive bonding is gaining more and more attention due to the increasing demand for joining similar or dissimilar components, mostly within the framework of designing...conference paper 2023
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Martin, H.A. (author), Reintjes, Marcia (author), Reijs, Dave (author), Dorrestein, Sander (author), Kengen, Martien (author), Libon, Sebastien (author), Smits, Edsger (author), Tang, Xiao (author), Koelink, Marco (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Integrated Circuits and Electronic Modules experience concentrated thermal hot spots, which require advanced thermal solutions for effective distribution and dissipation of heat. The superior thermal properties of diamonds are long known, and it is an ideal material for heat-spreading applications. However, growing diamond films to the...conference paper 2023
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Thukral, V. (author), Bacquet, Irene (author), Van Soestbergen, Michiel (author), Zaal, Jeroen (author), Roucou, Romuald (author), Rongen, Rene (author), van Driel, W.D. (author), Zhang, Kouchi (author)Board level vibration testing is a commonly used method to predict the solder joint reliability of surface-mounted components seated onto printed circuit boards (PCB). Current board level vibration test methods are mainly developed from a solely mechanical stress application standpoint. This makes such stress tests one dimensional in nature...conference paper 2023
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Du, L. (author), Zhao, Xiujuan (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of...conference paper 2023
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Martin, H.A. (author), Sattari, R. (author), Smits, E.C.P. (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)With an increasing demand for high-power electronics, the need to meet stringent automotive norms and better understand the critical failure mechanisms are crucial in order to improve their reliablity. To that end, we developed an in-situ reliability monitoring setup capable of actively measuring the thermal performance of the package during...conference paper 2022
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Inamdar, A.S. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Digital Twin can be broadly described as a continuously updated virtual representation of an object, system, or process which replicates all phases in the lifecycle of its physical counterpart. Originally conceptualized in 2003 [1], the term `Digital Twin' came into existence after it first appeared in NASA's roadmap in 2010 [2]. The concept...conference paper 2023
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Du, L. (author), Hu, D. (author), Poelm, René (author), van Driel, W.D. (author), Zhang, Kouchi (author)The application of microporous sintered copper (Cu) as a bonding material to replace conventional die-attach materials in power electronic devices has attracted considerable interest. Many previous studies have focused on the effect of processing parameters (temperature, time, pressure) on the microstructure evolution of sintered Cu. However,...conference paper 2023
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Hu, X. (author), Martin, H.A. (author), Poelma, René H. (author), Huang, J.L. (author), Rijckevorsel, H. (author), Scholten, H. (author), Smits, E.C.P. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Resin-reinforced silver (Ag) sintering material is an effective and highly reliable solution for power electronics packaging. The hybrid material’s process parameters strongly influence its microstructure and pose a significant challenge in estimating its effective properties as a thin interconnect layer. This research demonstrates a novel 3D...conference paper 2023
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Middelburg, L.M. (author), el Mansouri, B. (author), Poelma, René H. (author), van Zeijl, H.W. (author), Wei, J. (author), Zhang, Kouchi (author), van Driel, W.D. (author)The mechanical part of inertial sensors can be designed to have a large mechanical sensitivity, but also requires the transduction mechanism which translates this displacement. The overall system resolution in mechanical inertial sensors is dictated by the noise contribution of each stage and the magnitude of each sensitivity, see also Figure...conference paper 2018
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Yazdan Mehr, M. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This paper investigates degradation and failure mechanisms of BPA-PC lenses in simulated harsh environment conditions. Exposure of secondary optics in Light Emitting Diode LED-based systems or any other similar applications to environmental stresses can adversely effect the performance and lifetime of products. This paper simulates a harsh...conference paper 2019
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Sun, B. (author), Mo, J. (author), Zhang, Hemin (author), van Zeijl, H.W. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The thermal-piezoresistive effect in silicon (Si) has attracted great attention toward high-performance resonant devices but still faces major challenges for harsh environment applications. Instead of using Si, this paper, for the first time, reports a thermal-piezoresistive resonator based on a silicon carbide-on-insulator (SiCOI) platform. The...conference paper 2023
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Du, L. (author), Zhao, Xiujuan (author), Watte, Piet (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)The objective of this article is to investigate the thermal-fatigue properties of a commercially available lead-free solder alloy (SnBiAgCu) under the use of different types of potting compounds. Solder alloys with lower silver content are expected to substitute the conventional solder alloys SAC305 (Sn-3.0Ag-0.5Cu). First, the tensile...conference paper 2022