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Ahmadi, M. (author), Shekhar, A. (author), Bauer, P. (author)
Power electronic converters (PECs) are workhorses of emerging distribution networks. PEC interfaced grids can function as flexible power corridors facilitating compact and efficient energy exchange between distribution generation, load and storage elements. Introducing adequate Reconfigurability, Modularity, and Redundancy (RMR) in such PEC...
conference paper 2022
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Torres Alves, G.A. (author), 't Hart, C.M.P. (author), Morales Napoles, O. (author), Jonkman, Sebastiaan N. (author)
A submerged floating tunnel (SFT) is a structure that has been proposed as an innovative solution for waterway crossings around the world. However, to this day, no SFT has been constructed yet. One of the main reasons is that there is an insufficient insight into the structural reliability of the SFT. Here, a method to assess the expected...
journal article 2022
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Ahmadi, M. (author), Shekhar, A. (author), Bauer, P. (author)
Power electronics converters will play a crucial role in power grid expansion. Superior advantages offered by MMC make it the most popular candidate amongst various converter topologies. However, due to a large number of components installed within MMC, reliability analysis is an unavoidable task that needs to be carried out to maximize the MMC...
conference paper 2022
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Condia, Josie E.Rodriguez (author), Augusto da Silva, F. (author), Bagbaba, Ahmet Cagri (author), Guerrero-Balaguera, Juan-David (author), Hamdioui, S. (author), Sauer, Christian (author), Sonza Reorda, Matteo (author)
Editor's notes: GPUs have seen an increased adoption in autonomous systems. This article assesses the fault coverage that can be attained through software self-test strategies for in-field test of GPUs. - Nicola Nicolici, McMaster University
journal article 2022
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Fan, Jiajie (author), Jiang, Dawei (author), Zhang, Hao (author), Hu, D. (author), Liu, X. (author), Fan, Xuejun (author), Zhang, Kouchi (author)
Nano-copper sintering is one of new die-attachment and interconnection solutions to realize the wide bandgap semiconductor power electronics packaging with benefits on high temperature, low inductance, low thermal resistance and low cost. Aiming to assess the high-temperature reliability of sintered nano-copper die-attachment and...
journal article 2022
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Jiang, Jing (author), Chen, Wei (author), Qian, Yichen (author), Meda, Abdulmelik H. (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)
Considerable advancements in power semiconductor devices have resulted in such devices being increasingly adopted in applications of energy generation, conversion, and transmission. Hence, we proposed a fan-out panel-level packaging (FOPLP) design for 30-V Si-based metal-oxide-semiconductor field-effect transistor (MOSFET). To achieve...
journal article 2023
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Ahmadi, M. (author), Shekhar, A. (author), Bauer, P. (author)
Modular Multilevel Converters (MMCs) find increasing applications in medium to high-voltage systems. In such systems, reliability-oriented selection of power electronic switches becomes essential because higher modularity implies an increased number of components. The trade-off between the impact of higher modularity on converter reliability...
journal article 2023
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Chen, Wei (author), Jiang, Jing (author), Meda, Abdulmelik H. (author), Ibrahim, Mesfin S. (author), Zhang, Kouchi (author), Fan, J. (author)
SiC MOSFET is mainly characterized by the higher electric breakdown field, higher thermal conductivity, and lower switching loss enabling high breakdown voltage, high-temperature operation, and high switching frequency. However, their performances are considerably limited by the high parasitic inductance and poor heat dissipation capabilities...
journal article 2023
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Klerk, W.J. (author), van Bergeijk, Vera (author), Kanning, W. (author), Wolfert, A.R.M. (author), Kok, M. (author)
The condition of flood defence revetments is influenced by many different degradation processes such as animal burrowing, rutting and growth of weeds. Many of these processes are shock-based rather than progressive continuous. As shocks can cause a drop in performance, this means that the condition of a revetment can suddenly decrease,...
journal article 2023
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Geertsma, R.D. (author)
Editorial Special Issue: Naval Engineering and Ship Control II
contribution to periodical 2023
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Chaal, M. (author), Ren, X. (author), Bahootoroody, A. (author), Basnet, Sunil (author), Bolbot, Victor (author), Banda, Osiris A.Valdez (author), van Gelder, P.H.A.J.M. (author)
The safety and reliability of autonomous ships are critical for the successful realization of an autonomous maritime ecosystem. Research and collaboration between governments, industry, and academia are vital in achieving this goal. This paper conducts a bibliometric review of the research on the risk, safety, and reliability of autonomous ships...
review 2023
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Cervone, A. (author), Topputo, F. (author), Franzese, V. (author), Pérez-Silva, A. Rodríguez (author), Leon, B. Benavent (author), Garcia, B. Delmas (author), Minacapilli, P. (author), Rosa, P. (author), Bay, G. (author), Radu, S. (author)
The paper presents the initial outcomes of a project, currently ongoing under the supervision of the European Space Agency, having the main objective to specify and design a Fault Detection Isolation and Recovery (FDIR) system by making use of relevant RAMS (Reliability, Availability, Maintainability, Safety) analyses for missions in non...
journal article 2023
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Varkey, D. (author), Hicks, M.A. (author), van den Eijnden, A.P. (author)
The stability of six regional dyke cross-sections in the Netherlands was re-assessed using the random finite element method (RFEM), which explicitly accounts for the spatial variability of strength parameters. The RFEM assessments of the cross-sections were shown to result in significantly narrower response distributions than those obtained...
conference paper 2023
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Kardan Halvaei, F. (author), Ahmadi, M. (author), Shekhar, A. (author), Bauer, P. (author)
EV Fast chargers are crucial to alleviate the driving range anxiety for E-mobility applications. A typical converter load profile consists of a short high-current pulse to rapidly refill the EV battery followed by a cooling-off period once the charging is completed. Power electronic components experience thermal cycles as a result, which can...
conference paper 2023
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Zhao, Xiujie (author), Chen, P. (author), Lv, Shanshan (author), He, Zhen (author)
Return of products within the warranty coverage induces additional cost and loss of reputation to manufacturers. It is of practical interest to predict the return rate by experimental means before introducing a product to the market. In this paper, we propose to optimize accelerated reliability tests to achieve the goal within limited time....
journal article 2023
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Mao, Qi (author), Wang, Haiqing (author), Yang, M. (author), Hu, Jason (author)
Safety instrumented systems(SIS) have been widely used in petroleum and chemical plants to detect and respond to dangerous events and prevent them from developing into accidents. The in-service time of SIS does not exceed its useful life is one of the crucial assumptions of IEC functional safety standards. The testing method recommended in the...
journal article 2023
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Gonzalez Silva, J. (author), Ferrari, Riccardo M.G. (author), van Wingerden, J.W. (author)
As renewable energy sources such as wind farms become dominant, new challenges emerge for operating and controlling them. Traditionally, wind farm control aims to dispatch power set-points to individual turbines to maximize energy extraction and, thus, their usage as assets. Yet, grid balance and frequency support are fundamental in presence...
journal article 2023
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Pol, J.C. (author), Kindermann, P.E. (author), van der Krogt, M.G. (author), van Bergeijk, Vera M. (author), Remmerswaal, G. (author), Kanning, W. (author), Jonkman, Sebastiaan N. (author), Kok, M. (author)
Structural reliability analysis often considers failure mechanisms as correlated but non-interacting processes. Interacting failure mechanisms affect each others performance, and thereby the system reliability. We describe such interactions in the context of flood defenses, and analyze under which conditions such interactions have a large impact...
journal article 2023
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Zhang, Y. (author), Mo, J. (author), Vollebregt, S. (author), Zhang, Kouchi (author), May, Alexander (author), Erlbacher, Tobias (author)
The 4H-silicon carbide (SiC) exhibits excellent material characteristics, particularly in high-temperature, high-power, high-frequency applications. However, the reliability of SiC-based devices operating in harsh environments is a critical concern. While time-dependent dielectric breakdown (TDDB) in conventional SiC devices has been extensively...
conference paper 2023
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Molenaar, M. (author), Kardan Halvaei, F. (author), Shekhar, A. (author), Bauer, P. (author)
The reliability of semiconductor power devices can be studied by performing a thermal and power cycling test. In order to create the desired temperature cycles, there are four free variables to select during the power cycling test, namely the heating current, heating time, cooling time, and heatsink temperature. In this paper, the relation...
conference paper 2023
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