Searched for: %2520
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Tichem, M. (author), Peters, T.J. (author), Wu, K. (author)
Recent decades have seen impressive developments in the field of integrated<br/>photonics. Chips with complex photonic functionality can presently be designed<br/>and fabricated. Photonic packages consist of one or more PICs, as well as other<br/>(micro-optical) components, and a fibre (array) to establish the external optical<br/>interface. A...
journal article 2018
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Peters, T.J. (author), Tichem, M. (author)
In this paper, we present positionable photonic waveguide arrays that are developed for optical chip-to-chip alignment. Partly suspended photonic structures, based on the Si3N4/SiO2 material platform, are equipped with thermal actuators enabling the free end of the structures to be positioned with submicrometer accuracy. A finite-element model...
journal article 2017
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Peters, T.J. (author), Tichem, M. (author)
This paper describes the design, fabrication and characterization of electrothermal bimorph actuators consisting of polysilicon on top of thick (&gt;10 μm ) silicon dioxide beams. This material platform enables the integration of actuators with photonic waveguides, producing mechanically-flexible photonic waveguide structures that are...
journal article 2016
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Wörhoff, Kerstin (author), Prak, Albert (author), Postma, F. (author), Leinse, A (author), Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Amaning-Appiah, B. (author), Renukappa, V. (author), Vollrath, G. (author), Balcells-Ventura, J. (author), Uhlig, P. (author), Seyfried, M. (author), Rose, D. (author), Santos, Raquel (author), Leijtens, XJM (author), Flintham, B. (author), Wale, M. (author), Robbins, D. (author)
Fully automated, high precision, cost-effective assembly technology for photonic packages remains one of the main challenges in photonic component manufacturing. Next to the cost aspect the most demanding assembly task for multiport photonic integrated circuits (PICs) is the high-precision (±0.1 μm) alignment and fixing required for optical I...
conference paper 2016
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Peters, T.J. (author), Tichem, M. (author)
This paper reports on the progress related to a multichannel photonic alignment concept, aiming for sub-micrometer precision in the alignment of the waveguides of two photonic integrated circuits (PICs). The concept consists of two steps: chip-to-chip positioning and chip bonding provide a coarse alignment after which waveguide-to-waveguide...
conference paper 2016
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Wu, K. (author), Peters, T.J. (author), Tichem, M. (author), Postma, Ferry (author), Prak, Albert (author), Wörhoff, Kerstin (author), Leinse, Arne (author)
This paper proposes and tests a design of electro-thermal bimorph actuators for alignment of flexible photonic waveguides fabricated in 16 μm thick SiO<sup>2</sup>. The actuators are for use in a novel alignment concept for multi-port photonic integrated circuits (PICs), in which the fine alignment is taken care of by positioning of suspended...
conference paper 2016
document
Peters, T.J. (author), Tichem, M. (author)
conference paper 2016
document
Peters, T.J. (author), Tichem, M. (author)
This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. These structures are intended to be utilized in SiO2 photonic MEMS. A major fabrication challenge is the release of thick (>10 ?m) SiO2 structures with high yield. A single mask process is developed based on temporary reinforcement of the SiO2...
journal article 2015
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Peters, T.J. (author), Tichem, M. (author), Staufer, U. (author)
This paper presents a new alignment concept for the alignment of multichannel photonic intergrated circuits (PICs) using flexible photonic waveguides on one of the PICs that are positionable by integrated micro electro mechanical system (MEMS) actuators. The concept aims for high precision and high degree of assembly process automation. The...
conference paper 2014
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