High-performance wafer-scale transfer-free graphene microphones

A repeatable method to fabricate multi-layer graphene (ML-gr) membranes of 2r = 85 - 155 μm (t < 10 nm) with a 100% yield on 100 mm wafers is demonstrated. These membranes show higher sensitivity than a commercial MEMS-Mic combined with an area reduction of 10x. The process overcomes one of the main limitations when integrating graphene...

Sensitive Transfer-Free Wafer-Scale Graphene Microphones

During the past decades micro-electromechanical microphones have largely taken over the market for portable devices, being produced in volumes of billions yearly. Because performance of current devices is near the physical limits, further miniaturization and improvement of microphones for mobile devices poses a major challenge that requires...

Low power AlGaN/GaN MEMS pressure sensor for high vacuum application

A micro-scale pressure sensor based on suspended AlGaN/GaN heterostructure is reported with non-linear sensitivity. By sealing the cavity, vacuum sensing at various temperatures was demonstrated. To validate the proposed concept of the AlGaN/GaN vacuum sensor, a 700 µm diameter circular membrane was electrically characterized under applied...

Metal and Polymeric Strain Gauges for Si-based, Monolithically Fabricated Organs-on-Chips

Organ-on-chip (OOC) is becoming the alternative tool to conventional in vitro screening. Heart-on-chip devices including microstructures for mechanical and electrical stimulation have been demonstrated to be advantageous to study structural organization and maturation of heart cells. This paper presents the development of metal and polymeric...

MEMS enabled fast time-resolved X-ray diffraction characterization platform for copper nanoparticle sintering in heterogeneous integration applications

We report the design, fabrication and experimental investigation of a MEMS micro-hotplate (MHP) for fast time-resolved X-ray diffraction (TRXRD) study of Cu nanoparticle paste (nanoCu paste) sintering process. The device and its system are designed to have a 60 ms minimum time interval, uniform temperature distribution and variant gas...

6 DOF Force and Torque Sensor for Micro-manipulation Applications

This paper presents the design, fabrication and characterization of a piezoresistive 6 Degrees of Freedom (DOF) force and torque sensor to be used in micro-manipulation. The mechanical structure of the device consists of 7 suspended beams and a calibration structure, which can be replaced by micro-manipulation tools such as micro-grippers or...

Robust Wafer-Level Thin-Film Encapsulation (Packaging) of Microstructures (MEMS) using Low Stress PECVD Silicon Carbide

This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI...