- A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
- Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
- High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
- Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints