Enhancing luminous flux and color rendering of laser-excited YAG:Ce³⁺ single crystal phosphor plate via surface roughening and low-temperature sintering a CaAlSiN₃:Eu²⁺ phosphor-in-borate glass

The influencing factors of evaporation residue of emulsified modified asphalt to optimize the environmental adaptability

Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study

A Comprehensive Study on the Rejuvenation Efficiency of Compound Rejuvenators for the Characterization of the Bituminous Binder, Mortar, and Mixture

Luminous performances characterization of YAG: Ce3+ phosphor/silicone composites using both reflective and transmissive laser excitations

A 121.4-dB DR Capacitively Coupled Chopper Class-D Audio Amplifier

Sintering mechanism of Ag nanoparticle-nanoflake: a molecular dynamics simulation

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

A - 121.5-dB THD Class-D Audio Amplifier With 49-dB LC Filter Nonlinearity Suppression

Visualizing Dynamic Changes During TGF-β-Induced Epithelial to Mesenchymal Transition

Outlook: From Physics of Failure to Physics of Degradation

Implementation of Fully Coupled Electromigration Theory in COMSOL

High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

Simulation for stability of a beam-mass based high-resolution MEMS gravimeter

Effects of temperature and grain size on diffusivity of aluminium: electromigration experiment and molecular dynamic simulation

Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models

Solder joint reliability risk estimation by AI-assisted simulation framework with genetic algorithm to optimize the initial parameters for AI models

System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

In-air sintering of copper nanoparticle paste with pressure-assistance for die attachment in high power electronics