Effect of temperature and humidity on moisture diffusion in an epoxy moulding compound material

In this paper we propose a new multistep characterisation method to be able to map out the dependency of moisture diffusion parameters of a polymeric material over a range of temperature and humidity conditions in a limited amount of time. We do that by (1) using a moisture sorption analyser which can continuously monitor weight changes with...

Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

We propose an amorphous/porous molecular connection network generation algorithm for simulating the material stiffness of a low-k material (SiOC:H). Based on a given concentration of the basic building blocks, this algorithm will generate an approximate and large amorphous network. The molecular topology is obtained by distributing these blocks...

The chemical-mechanical relationship of the SiOC(H) dielectric film

Thin Film Interface Fracture Properties at Scales Relevant to Microelectronics

Micromechanical modeling of stress evolution induced during cure in a particle-filled electronic packaging polymer

Investigation on flip chip solder joint fatigue with cure-dependent underfill properties