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Announcing TU Delft Repository replacement
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2 July 2024
TU Delft Repository will be replaced with a fresh user friendly design with monthly new feature releases.
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Searched for: subject%3A%22Chip%255C+scale%255C+package%22
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Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges
Solder joint reliability risk estimation by AI-assisted simulation framework with genetic algorithm to optimize the initial parameters for AI models
Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method
Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component
Searched for: subject%3A%22Chip%255C+scale%255C+package%22
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