Design for Reliability of Wafer Level MEMS packaging

The world has seen an unrivaled spread of semiconductor technology into virtually any part of society. The main enablers of this semiconductor rush are the decreasing feature size and the constantly decreasing costs of semiconductors. The decreasing costs of semiconductors in general are caused by the smaller feature size, the higher yield and...

Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices

This paper discusses the assembly challenges considering the design and manufacturability of a Wafer Level Thin Film Package in MEMS applications. The assembly processes are discussed. The loads associated with these processes are illustrated and evaluated. Numerical calculations are combined with experimental observations in order to estimate...