Junction temperature and luminous flux prediction for white LED array based on electrical-photo-thermal modeling

Warpage deformation analysis of AMB ceramic substrates in power modules

Investigating the Sintering Process and Mechanical Properties of Nano-copper Particles Coupling Particle Packing Modeling with Molecular Dynamics Simulation

Double-sided heat dissipation numerical modeling of an embedded half-bridge power module with multiple chips

Assessment of Vigilance Level during Work: Fitting a Hidden Markov Model to Heart Rate Variability

High temperature viscoplastic deformation behavior of sintered nanocopper paste used in power electronics packaging: Insights from constitutive and multi-scale modelling

Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures

Implementation of Fully Coupled Electromigration Theory in COMSOL

Practical aspects of thermomechanical modeling in electronics packaging: A case study with a SiC power package

Design of a Fan-Out Panel-Level SiC MOSFET Power Module Using Ant Colony Optimization-Back Propagation Neural Network

Prognostics of radiation power degradation lifetime for ultraviolet light-emitting diodes using stochastic data-driven models

Insights into the high-sulphur aging of sintered silver nanoparticles: An experimental and ReaxFF study

Reliability assessment of ultra-deep oil and gas wellbore casing using data statistics and numerical simulations

Implementation of General Coupling Model of Electromigration in ANSYS

A Reliability Prediction Methodology for LED Arrays

Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps