Molecular dynamics simulations on mechanical behaviors of sintered nanocopper in power electronics packaging

Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...

Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging

During operation in environments containing hydrogen sulfide (H₂S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...

Study on Sintering Mechanism and Mechanical Properties of Nano-Cu based on Molecular Dynamics Simulation

Nano-metal materials sintering has received increasing attention in recent years for its promising performance in the wide bandgap semiconductor packaging. In this paper, molecular dynamics (MD) simulation method were applied to simulate the nano-Cu sintering mechanism and the subsequent mechanical behavior. Hybrid sintering, comprising...

Shear-slip behaviour of prefabricated composite shear stud connectors in composite bridges

This paper has investigated the shear-slip behaviour of an innovative prefabricated composite shear stud (PCSS) connector and its application in the prefabricated steel–concrete composite bridges. A series of push-out tests are carried out on a total of 12 specimens, including 6 PCSS specimens and 6 conventional shear stud (CSS) specimens....

Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

Modern power electronics has the increased demands in current density and high-temperature reliability. However, these performance factors are limited due to the die attach materials used to affix power dies microchips to electric circuitry. Although several die attach materials and methods exist, nanosilver sintering technology has received...