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Hu, D. (author)IN advancing the ’More thanMoore’ paradigm, heterogeneous integration has emerged to facilitate the creation of highly efficient, compact, and multi-functional semiconductor systems. Addressing the challenges related to power efficiency, superior performance, and integration density, low-temperature nanoparticle sintering technology has become...doctoral thesis 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Martin, H.A. (author), Smits, Edsger C.P. (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quantitative insights into package thermal performance degradation...journal article 2024
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Yun, Minghui (author), Yang, Daoguo (author), Cai, Miao (author), Yan, Haidong (author), Yu, Jiabing (author), Liu, Mengyuan (author), He, Siliang (author), Zhang, Kouchi (author)Metal-oxide-semiconductor field-effect transistors (MOSFETs) undergo fatigue degradation under high thermal and electrical stresses. This process results in changes in their parasitic parameters, which can be detected using frequency domain reflectometry (FDR). Frequency domain impedance analysis is employed to characterize the various...journal article 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...conference paper 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...journal article 2024
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Martin Saint-Laurence, P.M. (author), Aguilar, C. (author), Cabrera, J. M. (author)Refractory high-entropy alloys (RHEAs) are promising candidates for those applications requiring of strong materials at high temperatures with elevated thermal stability and excellent oxidation, irradiation, and corrosion resistance. Particularly, RHEAs synthesized using mechanical alloying (MA) followed by spark plasma sintering (SPS) has...journal article 2024
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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...journal article 2024
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van den Berg, D. (author), Brouwer, J.C. (author), Hendrikx, R.W.A. (author), Kortlever, R. (author)In this study, we experimentally screen a promising class of intermetallic alloys for the electrochemical reduction of CO<sub>2</sub> toward hydrocarbon products. Based on previous DFT-based screening papers, combinations of strongly CO-binding metals such as iron, cobalt, and nickel with weakly CO-binding metals such as gallium, aluminium or...journal article 2024
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Wang, Xinyue (author), Chen, Haixue (author), Yang, Zhoudong (author), Liu, Wenting (author), Zeng, Zejun (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, Jiajie (author), Liu, Pan (author)With the increased deployment of power modules in demanding conditions, sintering materials, especially composite sintering materials, have raised growing interest due to their cost-effectiveness and suitability. Therefore, this study explores the viability of Cu–Ag composite sintering material, focusing on solvent influence through...journal article 2024
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Wang, Chieh (author)This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.<br/>The primary focus is...master thesis 2023
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Manos, Peter (author)For the first time since the 1970s, concrete plans are in motion to bring humans back to the Moon through the Artemis programme. The dawning era of space exploration aims to set the groundwork for long-term off-Earth settlement, with sights on bringing the first humans to Mars. In order to provide a safe means of inhabiting extraterrestrial (ET)...master thesis 2023
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- Liu, X. (author) doctoral thesis 2023
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Long, Xu (author), Chong, Kainan (author), Su, Yutai (author), Du, L. (author), Zhang, Kouchi (author)The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...journal article 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...conference paper 2023
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Li, Shizhen (author), Jiang, Jing (author), Liu, X. (author), Wang, S. (author), Zhang, Zhonghua (author), Ye, Huaiyu (author)Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and...conference paper 2023
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Hu, D. (author), Li, Z. (author), Fan, J. (author), Zhang, Kouchi (author)As a critical part of speeding up industrial electrification, power electronics, and its packaging technology are undergoing rapid development. Cu nanoparticle sintering technology has therefore received extensive attention for its excellent performance in the die-attachment layer, where the mechanical properties are essential to be known for...conference paper 2023