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Luo, Runding (author), Hu, D. (author), Qian, Cheng (author), Liu, Xu (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Hu, D. (author), Liu, X. (author), Zhu, Xi (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)During operation in environments containing hydrogen sulfide (H<sub>2</sub>S), such as in offshore and coastal environments, sintered nanoCu in power electronics is susceptible to degradation caused by corrosion. In this study, experimental and molecular dynamics (MD) simulation analyses were conducted to investigate the evolution and...journal article 2024
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Martin, H.A. (author), Smits, Edsger C.P. (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)This article introduces an online condition monitoring strategy that utilizes a transient heat pulse to detect package thermal performance degradation. The metric employed is the temperature-dependent transient thermal impedance "Zth(t, Tamb)."The proposed methodology offers quantitative insights into package thermal performance degradation...journal article 2024
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Hu, D. (author), Du, L. (author), Alfreider, Markus (author), Fan, J. (author), Kiener, Daniel (author), Zhang, Kouchi (author)To fulfill the high-temperature application requirement of high-power electronics packaging, Cu nanoparticle sintering technology, with benefits in low-temperature processing and high-melting point, has attracted considerable attention as a promising candidate for the die-attach interconnect. Comprehensive mechanical characterization of the...journal article 2024
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Yun, Minghui (author), Yang, Daoguo (author), Cai, Miao (author), Yan, Haidong (author), Yu, Jiabing (author), Liu, Mengyuan (author), He, Siliang (author), Zhang, Kouchi (author)Metal-oxide-semiconductor field-effect transistors (MOSFETs) undergo fatigue degradation under high thermal and electrical stresses. This process results in changes in their parasitic parameters, which can be detected using frequency domain reflectometry (FDR). Frequency domain impedance analysis is employed to characterize the various...journal article 2024
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Chen, Wei (author), Liu, Xu (author), Yang, Zhoudong (author), Liu, X. (author), Hu, D. (author), Zhu, Xi (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)The power semiconductor joining technology through sintering of copper nanoparticles is well-suited for die attachment in wide bandgap (WBG) semiconductors, offering high electrical, thermal, and mechanical performances. However, sintered nanocopper will be prone to degradation resulting from corrosion in sulfur-containing corrosive...journal article 2024
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Martin Saint-Laurence, P.M. (author), Aguilar, C. (author), Cabrera, J. M. (author)Refractory high-entropy alloys (RHEAs) are promising candidates for those applications requiring of strong materials at high temperatures with elevated thermal stability and excellent oxidation, irradiation, and corrosion resistance. Particularly, RHEAs synthesized using mechanical alloying (MA) followed by spark plasma sintering (SPS) has...journal article 2024
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Li, Shizhen (author), Liu, X. (author), Gao, Chenshan (author), Wang, S. (author), Li, Jun (author), Ye, Huaiyu (author), Zhang, Kouchi (author), Wu, Shaohui (author)The significance of wafer bonding is fundamental to the progression of electronic systems. Common fabrication techniques for Cu pillars play a crucial role in establishing resilient and efficient interconnects within semiconductor devices. It is imperative to explore the potential of nano-copper as an alternative material to overcome limitations...conference paper 2024
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Hu, X. (author), Huang, Jianlin (author), Poelma, René H. (author), van Driel, W.D. (author), Zhang, Kouchi (author)Low-temperature sintering technology of Ag nanoparticles is widely used in high-power electronic device packaging. Utilizing simulation methods to comprehend and control the microstructure and properties of Ag sintering materials has emerged as a prominent research area. This work uses the General Form PDE module in COMSOL to simplify the...conference paper 2024
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Liu, Xu (author), Hu, D. (author), Li, Z. (author), Fan, Xuejun (author), Zhang, Kouchi (author), Fan, J. (author)The nano-copper particles are widely used in the sintering processes of packaging wide bandgap semiconductors. Despite the significant success in the industry, the mechanism bridging the sintering process to the mechanical properties of sintered nano-copper is not yet well-modeled. In this paper, the impacts of different sintering temperatures...conference paper 2024
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- Liu, X. (author) doctoral thesis 2023
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Long, Xu (author), Chong, Kainan (author), Su, Yutai (author), Du, L. (author), Zhang, Kouchi (author)The stress–strain response of sintered silver nanoparticles (AgNP) materials is precisely characterized in order to adapt for numerical analysis and rational design of electronic packaging structures in this study. A framework of crystal plasticity finite element method (CPFEM) is established based on the mechanism of crystal plastic...journal article 2023
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Sattari, R. (author), Hu, D. (author), Liu, X. (author), van Zeijl, H.W. (author), Vollebregt, S. (author), Zhang, Kouchi (author)The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal...journal article 2023
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Živković, Aleksandar (author), Solsona-Delgado, Vanessa (author), van der Linden, B. (author), de Leeuw, Nora H. (author), Melián-Cabrera, Ignacio (author)A descriptor of active CuO-ZnO(Al<sub>2</sub>O<sub>3</sub>) methanol-synthesis and water–gas-shift catalysts is the presence of high-temperature carbonates (HT-CO<sub>3</sub>) in the oxidic catalyst precursor. Previous reports have shown that such HT-CO<sub>3</sub> lead to an appropriate interaction between the oxides; as a result, a high Cu...journal article 2023
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Cernuschi, Federico (author), Kulczyk-Malecka, Justyna (author), Zhang, Xun (author), Nozahic, Franck (author), Estournès, Claude (author), Sloof, W.G. (author)The thermal diffusivity and conductivity of dense and porous binary composites having an insulating and conducting phase were studied across its entire composition range. Experimental evaluation has been performed with MoSi<sub>2</sub> particles embedded into yttria partially stabilized zirconia (YPSZ) as prepared by spark plasma sintering ...journal article 2023
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Goel, Avishek (author), Ismailov, Arnold (author), Mohammadzadeh Moghaddam, E. (author), He, Chao (author), Konttinen, Jukka (author)Biomass Chemical Looping Gasification (BCLG) is a cost-effective and efficient alternative to conventional gasification. The selection of appropriate oxygen carriers (OCs) is crucial for stable BCLG performance. These OCs need to possess high reactivity, selectivity, material strength, and resistance to sintering. The study investigated...journal article 2023
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Hu, D. (author), Qian, Cheng (author), Liu, X. (author), Du, L. (author), Sun, Zhongchao (author), Fan, X. (author), Zhang, Kouchi (author), Fan, J. (author)As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In...journal article 2023
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Wang, Xinyue (author), Yang, Zhoudong (author), Wang, Boya (author), Chen, Wei (author), Zhang, Kouchi (author), Zhang, Jing (author), Fan, J. (author), Liu, P. (author)Power modules applied in offshore applications are facing risks of corrosion failures on die-attach materials due to high humidity and H<sub>2</sub>S exposure. To investigate such corrosion behavior for sintered die-attach materials, we conducted a study with four groups of samples fabricated using copper and silver metal particles under...journal article 2023
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Bhootpur, N. (author), Brouwer, J.C. (author), Tang, Y. (author)In the past decades, Zirconia (ZrO<sub>2</sub>) has emerged as a promising technical ceramic, both as high temperature structural material and electrolyte for fuel cells, etc. The traditional synthesis of ZrO<sub>2</sub> with spark plasma sintering (SPS) usually requires a sintering temperature as high as 1200 °C. General interest in lowering...journal article 2023
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Sattari, R. (author), van Zeijl, H.W. (author), Zhang, Kouchi (author)Wide bandgap (WBG) semiconductor technologies enable significant progress in the emergence of power modules. Power cycling at elevated temperatures causes crack or delamination failure, especially at the die-attached bonded interface in the long term. Therefore, the in-situ reliability investigation of power modules, materials, and...conference paper 2023