Interdigitated back-contacted solar cell (IBC) is a successful high-efficiency solar cell concept. Without a metal grid at the front side, the metal shading loss is eliminated. However, the fabrication process of an IBC cell is much more complicated than that of a FBC cell. Within the PVMD group, two poly-Si carrier-selective passivating contacts (CSPCs) IBC cell fabrication methods were developed, namely Self-aligned and Etch-back method. These two methods require respectively to pattern the IBC rear side twice and three times to define the emitter and BSF area. In this project, a novel poly-Si/SHJ hybrid IBC solar cell design using tunneling recombination junction (TRJ) is proposed, which only requires one pattern step to define the emitter and BSF area, thus, significantly simplifies the flowcharts of IBC cells. The main objective of this thesis is to demonstrate the novel poly-Si/SHJ hybrid TRJ IBC cell concept by fabricating such high-efficiency hybrid IBC cells. With the proposed hybrid IBC cell design, the BSF layers are deposited on the full rear side after the emitter patterning. Thus, a TRJ is introduced at the emitter ((p+)poly-Si). The carrier tunneling efficiency across the TRJ layers should be guaranteed. The BSF layers passivation quality is also crucial for hybrid IBC cell performance, and the shunting due to the full area deposited BSF layers should be limited as well. The TRJ proof-of-concept was firstly demonstrated in FBC cells due to their easier fabrication processes. And different materials combinations of (i)a-Si:H, (n)a-Si:H and (n)nc-Si:H were used to form TRJ with (p+)poly-SiOx. Firstly, it was found that the existence of (i)a-Si:H is detrimental to the device performance, especially for the cell FF. Secondly, for cells without (i)a-Si:H layer, the cell performance was improved by replacing (n)a-Si:H with more conductive and low activation energy (n)nc-Si:H layer. At last, the TRJ with dual-n-layer, (p+)poly-SiOx/(n)a-Si:H/(n)nc-Si:H, was found to be most promising. And the cell FF decreases with (n)a-Si:H layer thickness. However, instead of only depositing (n)nc-Si:H, the (n)a-Si:H was kept for its better passivation ability than (n)nc-Si:H, as it is directly deposited on the c-Si surface at BSF in hybrid IBC cells. Then the hybrid design with dual-n-layer was demonstrated and optimized regarding the passivation quality, TRJ efficiency and the Rshunt in IBC cells. We firstly demonstrated that poly-Si delivers better performance than poly-SiOx due to its lower resistivity. With 18 nm(at textured BSF)(n)n-Si:H, the (n)a-Si:H layer thickness optimizes at 3 nm in poly-Si/SHJ hybrid cells. The pitch width was also found to have an influence on cell external parameters as the number of fingers decreases with pitch width. The cell FF increases and the Jsc decreases with pitch widening. The best cell obtained in this project has 3/18 nm (n)a-Si:H/(n)nc-Si:H and a medium pitch width (650 μm). It has a Voc of 665 mV, a Jsc of 39.36 mA/cm2, a FF of 74.33% and an efficiency of 19.45%.