Evaluating the temporal stability and risk of unsaturated soil slopes during rainfall is essential for early warning and emergency response to landslides. However, limited research has been conducted on the transition timing of sliding mechanisms, instability/failure time and the integration of sliding consequences into quantitative risk assessment. In order to extend the research in this field, the Random Finite Element Method (RFEM) is used in this paper to investigate the influence of spatial variability of hydraulic properties (related to the fundamental parameter porosity) on the temporal stability and risk of soil slopes subject to rainfall. The findings indicate that the advancing speed of the wetting front is more rapidly in zones with low porosity than that in zones with high porosity. As rainfall progresses, the sliding mechanism of the slope shifts from deep sliding to shallow sliding. The homogeneous case tends to underestimate the rise in groundwater levels, leading to an overestimation of slope stability. Hydraulic boundary conditions significantly affect slope stability, making it crucial to consider horizontal (or near the toe of the slope) drainage conditions in practical applications. Additionally, the time of instability/failure predicted in the homogeneous case may be delayed compared to the actual conditions. Both probability of instability/failure and risk increase with continued rainfall. Compared to scenarios where the spatial variability of internal friction angle is not considered, the probability of instability/failure and risk will be higher when the spatial variability of internal friction angle is additionally considered. Risk-based assessment can define the risk levels, reflecting the severity of sliding consequences. Furthermore, the Malin slope failure record from the Chibo region of India is used to validate the effectiveness of the proposed approach. The probabilities of slope failure align well with actual observations, and the risk-based assessment provides additional information into the Malin landslide. This paper proposes a general model for studying the performance of heterogeneous slopes subject to rainfall, providing valuable guidance for landslide early warning systems and the scope and timing of emergency measures taken.

Nano-metal materials have received considerable attention because of their promising performance in wide bandgap semiconductor packaging. In this study, molecular dynamics (MD) simulation was performed to simulate the nano-Cu sintering mechanism and the subsequent mechanical behaviors. Hybrid sintering, comprising nanosphere (NS) and nanoflake (NF), was performed at temperatures from 500 to 650 K. Furthermore, shear and tensile simulations were conducted with constant strain rates on the sintered structure at multiple temperatures. Subsequently, the extracted mechanical properties were correlated with the sintering behavior. The results revealed that the mechanical properties of the nano-Cu sintered structure could be improved by tuning material composition and increasing the sintering temperature. We established a relationship between the sintered microstructure and mechanical response. The shear modulus and shear strength of the sintered structure with NF particles increased to 41.20 and 3.51 GPa respectively. Furthermore, the elastic modulus increased to 55.60, and the tensile strength increased to 4.88 GPa. This result provides insights into the preparation phase of nano-Cu paste for sintering technology.

As a promising technology for high-power and high-temperature power electronics packaging, nanocopper (nanoCu) paste sintering has recently received increasing attention as a die-attachment. The high-temperature deformation of sintered nanoCu paste and its underlying mechanisms challenge the reliability of high-power electronics packaging. In this study, the tensile deformation behaviors of sintered nanoCu paste were firstly characterized by high-temperature tensile tests performed at various temperatures and strain rates ranging from 180 °C to 360 °C, 1 × 10⁻⁴ s⁻¹ to 1 × 10⁻³ s⁻¹ respectively. It was found that the elastic modulus and tensile strength decreased at the higher tensile temperature while the ductility increased accordingly. The highest elastic modulus and tensile strength results were 12.15 GPa and 46.97 MPa, respectively. Second, failure analysis was conducted based on the fracture surface after tensile testing. Recrystallization was revealed as the main factor for ductility improvement. Subsequently, an Anand model was fitted by stress-strain curves to describe the tensile constitutive behavior of the sintered nanoCu paste. Multi-scale modelling techniques also investigated the impact of tensile temperature and strain rate on the tensile response. Molecular dynamics simulation was implemented using a hemispherical Cu nanoparticle model to reveal the properties from an atomistic perspective. In addition, a two-dimensional equivalent model was further established by using a stochastically distributed void morphology. The multi-scale modelling techniques successfully describe the evolution of tensile response to the different tensile temperatures and strain rates. Besides, the equivalent model with random void morphology was demonstrated as the finite element simulation results were highly consistent with the high-temperature tensile experiments.