Cement-based columns in combination with geosynthetic reinforcement is a well-established soft ground improvement technique to enhance embankment stability. This paper aims to present a finite-element (FE) study based on a case history of a geosynthetic-reinforced column-supported (GRCS) embankment over soft soil. In this study, the columns are simulated with an advanced Concrete model to simulate the development of possible cracking and induced strain-softening. Numerical results are compared against published centrifuge tests, giving confidence to the established FE model with the Concrete model. New insights into the progressive failure mechanisms of GRCS embankments over soft soil are then discussed by examining the stress paths, internal forces, and cracks, as well as the plastic failure zones of columns. In addition, the role of columns and geosynthetics on the progressive failure mechanisms (failure loads and sequences) is also examined by an extensive parametric study. The results suggest that provided the optimization of compressive and tensile forces in the columns combined with the tensile stiffness of the geosynthetics is put in place, more columns can be mobilized to resist global sliding failure and to improve the bearing capacity of GRCS embankments.@en

The rapid development of the economy has promoted the growth of freight transportation. The truck service areas on expressways, as the main places for truck drivers to rest, play an important role in ensuring the driving safety of trucks. If these service areas are constructed densely or provide a plentiful supply of parking areas, they are costly to construct. However, if the distance between two adjacent truck service areas is very large or the number of truck parking spaces in service areas is small, the supply will fail to meet the parking needs of truck drivers. In this situation, the continuous working time of truck drivers will be longer, and this is likely to cause driver fatigue and even traffic accidents. To address these issues, this paper established a non-linear optimization model for truck service area planning of expressways to optimize truck driving safety. An improved genetic algorithm is proposed to solve the model. A case study of a 215.5-kilometers-length section of the Guang-Kun expressway in China was used to demonstrate the effectiveness of the model and algorithm. As validated by this specific case, the proposed model and solution algorithm can provide an optimal plan for the layout of truck service areas that meet the parking needs of truck drivers while minimizing the service loss rate. The research results of this paper can contribute to the construction of truck service areas and the parking management of trucks on expressways.@en

The diversified system requirements have been continuously growing to drive the development of a variety of new package styles. Wafer-Level Packaging (WLP) technology has drawn attention with its thinner package due to the removal of substrate and thus higher performance. With the greater design flexibility in having more I/Os, Fan-out Wafer Level Packaging (FOWLP) technology has proven to be a more optimal and promising solution. Infineon's eWLB was introduced as the first generation FOWLP technology. In the eWLB technology, die shift is the processing defect that the die moves from its default position result in the wire disconnection. Placing the dies at the preset pitch can compensate the die shift before die attach process. In this paper, the key factors to controlling die shift will be discussed, and the complex process capability index (Cpk) of process is 2.06 which represents the die shift can be well minimized after compensation.@en

The diversified system requirements have been continuously growing to drive the development of a variety of new package styles. Wafer-Level Packaging (WLP) technology has drawn attention with its thinner package due to the removal of substrate and thus higher performance. With the greater design flexibility in having more I/Os, Fan-out Wafer Level Packaging (FOWLP) technology has proven to be a more optimal and promising solution. Infineon's eWLB was introduced as the first generation FOWLP technology. In the eWLB technology, die shift is the processing defect that the die moves from its default position result in the wire disconnection. Placing the dies at the preset pitch can compensate the die shift before die attach process. In this paper, the key factors to controlling die shift will be discussed, and the complex process capability index (Cpk) of process is 2.06 which represents the die shift can be well minimized after compensation.@en