In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with optical windows between the light masking layer and CMOS image sensor implemented by adhesively bonded glass windows. The CMOS sensor functionality is experimentally verified by modulation of a light spot using a laser. The proposed approach enables wafer-scale fabrication of the 3D optics that includes the wafer stepper accurate overlay alignment of the apertures. This mitigates the need for cumbersome alignment of the apertures at die or package level and facilitates further miniaturization, accuracy and sensor cost.