Towards a Scalable Sun Position Sensor with Monolithic Integration of the 3d Optics for Miniaturized Satellite Attitude Control

Conference paper (2021)

Authors

J. Romijn Electronic Components, Technology and Materials -

S. Vollebregt Electronic Components, Technology and Materials -

H.W. van Zeijl Electronic Components, Technology and Materials -

Kouchi Zhang Electronic Components, Technology and Materials -

J Leijtens Lens R&D BV

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

DOI

https://doi.org/10.1109/MEMS51782.2021.9375434

CMOS image sensor Adhesive bonding Sun position sensor 3D integrated optics

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http://resolver.tudelft.nl/uuid:33f210d1-4a67-4f47-b641-c82f2ca419d3

Published Date

2021

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

In this paper we present a sun position sensor platform with a scalable approach for the 3D integration of the sensor optics. This would facilitate the sun position sensor miniaturization, reduces fabrication cost and mitigates the need for sensor calibration. The sun position sensor platform is implemented in a seven mask BICMOS technology with optical windows between the light masking layer and CMOS image sensor implemented by adhesively bonded glass windows. The CMOS sensor functionality is experimentally verified by modulation of a light spot using a laser. The proposed approach enables wafer-scale fabrication of the 3D optics that includes the wafer stepper accurate overlay alignment of the apertures. This mitigates the need for cumbersome alignment of the apertures at die or package level and facilitates further miniaturization, accuracy and sensor cost.

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