With fossil fuels being phased out and growing global interest in a hydrogen economy, there is demand for re-purposing existing pipelines for transportation of hydrogen gas. However, hydrogen embrittlement (HE) can limit pipeline steel’s performance. In this study, the effect of hydrogen on the mechanical properties of an X60 base metal (polygonal ferrite/pearlite) and its girth weld (acicular ferrite/pearlite) was measured with a novel slow strain rate tensile (SSRT) test in which hollow pipe-like specimens were internally pressurised with nitrogen and hydrogen gas from 0 to 100 bars. Results showed that exposure to H2 gas at 100 bars reduced the ductility of the base metal by up to 40% and the weld metal by 14%. Reduction in cross-sectional area (%RA) reduced by up to 28% in the base metal and 11% in the weld metal. Fracture surface analysis showed micro-void coalescence as well as quasi-cleavage fracture characteristic of HE. Susceptibility to HE was also observed in the form of secondary longitudinal and internal transverse cracks.@en

The addition of Cu nanoparticles into the solder pastes by mechanical mixing method creates a positive effect on the microstructure refinement of the LED solder joints. The grain size of-Sn and Cu6Sn5 decrease obviously due to the increasing concentration of the nanoparticles in the solder pastes. However, the addition of nanoparticles facilitates the formation of voids in the solder joints, especially when the concentration of nanoparticles is higher than 0.5 wt% in the solder pastes. Both the microstructure refinement and void percentage affect the shear strength of the solder joints. Since the increase of the void percentage is limited when the concentration of nanoparticles increases from 0 to 0.5 wt%, the microstructure refinement shows a dominant effect on the shear performance and thus improves the shear strength of the solder joints from 49.8 to 55 MPa. Further addition of nanoparticles in the solder pastes leads to a sharp increase of the void percentage. Consequently, the shear strength of the solder joints decreases from 55 to 48.8 MPa when the concentration of doped particles increases from 0.5 to 1 wt% in the solder pastes.@en