We present a photonic integration method combining flip-chip bonding and photonic wirebonding. This approach enables a 'mother' substrate to host 'child' chips from diverse platforms, fostering seamless integration for multi-functional photonic architectures.

We present frequency-tunable, photolithography compatible superconducting microwave resonators designed for integration with electro-optic devices. We demonstrate >500 MHz of tuning with a bulk permanent magnet and > 1 00 MHz of tuning with planar coils under moderate (<5 mT) magnetic fields.

This work presents a superconducting microwave resonator that is both frequency tunable and compatible with photolithography. This design is well-suited for integration with electro-optic devices. We demonstrate tuning ranges exceeding 500 MHz, using a bulk permanent magnet, and 100 MHz, using planar coils, under moderate magnetic fields (below 5 mT).

We present an optically packaged thin film lithium niobate device. We show that this packaged device is capable of cryogenic operation and is resistant to extreme thermal shock.