In the efficiency-driven photovoltaic (PV) industry, the market dominating crystalline silicon (c-Si) technology has been developing towards PV devices with carrier-selective passivating contacts (CSPCs). Especially, the silicon heterojunction (SHJ) solar cell, based on hydrogenated amorphous silicon (a-Si:H) contact stacks, and the poly-Si solar cell, based on ultrathin SiOx/poly-Si passivating contacts, pave the way for power conversion efficiencies above 26%, approaching the theoretical limit of the c-Si solar cell. In case of front/back-contacted (FBC) architectures, to minimize the optical parasitic absorption at the emitter and/or surface field side(s), thin doped silicon layers are normally applied, which exhibit high sheet resistance. Accordingly, transparent conductive oxide (TCO) layers are required to ensure sufficient lateral carrier transport towards the metal electrodes. However, problems still exist in contacting schemes for high-efficiency solar cell design towards future multi-terawatt production of PV modules, regarding the development of TCO layer with high carrier mobility (μ), its integration into specific device structures, and more importantly, the material availability. In this work, we present three types of TCO materials. They are tin-, fluorine- and tungsten-doped indium oxide layers, namely, ITO, IFO, and IWO. RF magnetron sputtering approach has been utilized to deposit the films. The TCOs are integrated into both low thermal-budget SHJ and high thermal-budget poly-Si solar cells. Further, to address the sustainability implication related to indiumconsumption, we propose a strategy of bifacial SHJ solar cell with reduced TCO use. Meanwhile, to reduce silver (Ag) consumption, as well as to reach good solar cell performance in our laboratory, we have developed a platformfor bifacial copper (Cu)-platingmetallization approach. Specific results are summarized as follows...