Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

M Saadaoui (TU Delft - Electronic Components, Technology and Materials)

H van Zeijl (External organisation)

W.H.A. Wien (TU Delft - Electronic Components, Technology and Materials)

HTM Pham (TU Delft - Electronic Components, Technology and Materials)

C. Kwakernaak (OLD Surface and Interface Engineering)

HCM Knoops (External organisation)

WMM Kessels (External organisation)

RMCM van de Sanden (External organisation)

FC Voogt (External organisation)

F Roozeboom (External organisation)

PM Sarro (TU Delft - Electronic Components, Technology and Materials)