Enhancing the wettability of high aspect-ratio through-silicon vias lined with LPCVD silicon nitride of PE-ALD titanium nitride for void-free bottom-up copper electroplating

Journal article (2011)

Authors

M Saadaoui Electronic Components, Technology and Materials - EEMCS
H van Zeijl External organisation
Pasqualina M Sarro Electronic Components, Technology and Materials - EEMCS
W.H.A. Wien Electronic Components, Technology and Materials - EEMCS
HTM Pham Electronic Components, Technology and Materials - EEMCS
C. Kwakernaak OLD Surface and Interface Engineering
HCM Knoops External organisation
WMM Kessels External organisation
RMCM van de Sanden External organisation
FC Voogt External organisation
F Roozeboom External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2011

Language

Undefined/Unknown

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials