Analysis of Cu/low-k bond pad delamination by using a novel failure index
Conference Paper
(2005)
Author(s)
MAJ van Gils (External organisation)
O van der Sluis (External organisation)
Guo Qi Z Zhang (TU Delft - Dynamics of Micro and Nano Systems)
JHJ Jansen (External organisation)
RMJ Voncken (External organisation)
Research Group
Dynamics of Micro and Nano Systems
To reference this document use:
https://resolver.tudelft.nl/uuid:47e74f79-d846-404a-8cbf-ce68635658d1
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Publication Year
2005
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
190-196
ISBN (print)
0-7803-9062-8
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