Analysis of Cu/low-k bond pad delamination by using a novel failure index

Conference paper (2005)

Authors

MAJ van Gils External organisation
O van der Sluis External organisation
Kouchi Zhang Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
JHJ Jansen External organisation
RMJ Voncken External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2005

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems