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RMJ Voncken
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2 records found
Novel damage model for delamination in Cu/low-k IC backend structures
Conference paper -
MAJ van Gils
,
O van der Sluis
,
Kouchi Zhang
,
JHJ Janssen
,
RMJ Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index
Conference paper -
MAJ van Gils
,
O van der Sluis
,
Kouchi Zhang
,
JHJ Jansen
,
RMJ Voncken