RMJ Voncken | TU Delft Repository

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RMJ Voncken

Conference paper (2)

2 records found

1

Analysis of Cu/low-k bond pad delamination by using a novel failure index

Conference paper (2005) - MAJ van Gils (author) , O van der Sluis (author) , Guo Qi Z Zhang (author) , JHJ Jansen (author) , RMJ Voncken (author)

Novel damage model for delamination in Cu/low-k IC backend structures

Conference paper (2005) - MAJ van Gils (author) , O van der Sluis (author) , Guo-Qi Zhang (author) , JHJ Janssen (author) , RMJ Voncken (author)