High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Conference Paper (2023)
Author(s)

L. Du (TU Delft - Electronic Components, Technology and Materials)

Xiujuan Zhao (Signify)

R.H. Poelma (Nexperia B.V., TU Delft - Electronic Components, Technology and Materials)

Willem van Driel (TU Delft - Electronic Components, Technology and Materials, Signify)

G. Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2023 L. Du, Xiujuan Zhao, René H. Poelma, W.D. van Driel, Kouchi Zhang
DOI related publication
https://doi.org/10.1109/ECTC51909.2023.00072
More Info
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Publication Year
2023
Language
English
Copyright
© 2023 L. Du, Xiujuan Zhao, René H. Poelma, W.D. van Driel, Kouchi Zhang
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
392-395
ISBN (electronic)
9798350334982
Reuse Rights

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Abstract

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of commercial SAC305 (Sn-3.0Ag-0.5Cu). Secondly, dynamic mechanical analyses were performed to get the storage modulus and glass transition temperature of potting compounds. Finally, a finite element modeling based analysis were used to figure out the different failure mechanism due to the presence of potting materials. The accurate simulation data offers an optimization reference for the selection of solder and potting materials.

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