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High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Conference Paper (2023)
Author(s)

Leiming Du (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Xiujuan Zhao (Signify)

Rene Poelma (Nexperia, TU Delft - Electrical Engineering, Mathematics and Computer Science)

Willem Van Driel (Signify, TU Delft - Electrical Engineering, Mathematics and Computer Science)

Guoqi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ECTC51909.2023.00072 Final published version
More Info
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Publication Year
2023
Language
English
Research Group
Electronic Components, Technology and Materials
Bibliographical Note
Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.
Pages (from-to)
392-395
Publisher
IEEE
ISBN (electronic)
9798350334982
Event
73rd IEEE Electronic Components and Technology Conference, ECTC 2023 (2023-05-30 - 2023-06-02), Orlando, United States
Downloads counter
320
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Institutional Repository
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Abstract

SnBiAgCu solder alloy is an attractive soldering material for temperature-sensitive electronic devices due to its excellent creep properties. This study firstly reports the creep properties of SnBiAgCu solder alloy under different temperatures. Results show that the addition of Bi resulted in better creep resistance compared with that of commercial SAC305 (Sn-3.0Ag-0.5Cu). Secondly, dynamic mechanical analyses were performed to get the storage modulus and glass transition temperature of potting compounds. Finally, a finite element modeling based analysis were used to figure out the different failure mechanism due to the presence of potting materials. The accurate simulation data offers an optimization reference for the selection of solder and potting materials.

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