Prognostics and thermal management of power electronic packages

Abstract

Developing reliable and efficient power semiconductors is essential to realizing a sustainable future. Packaging materials for high-power applications are electrically overstressed, are exposed to harsh environmental conditions, and are subjected to heightened temperature swings, thereby compromising the device’s stability and longevity. In this dissertation, a series of experimental methodologies were explored for monitoring the package conditions, particularly the die-attach interface, which transmits the necessary electrical, thermal, and mechanical signals from the device to the system. Furthermore, advanced thermal management strategies were investigated to circumvent concentrated microthermal hot spots and improve the device’s power rating.