A front-End ASIC for Miniature 3-D Ultrasound Probes with In-Probe Receive Digitization

Conference Paper (2017)
Author(s)

Chao Chen (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Zhao Chen (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Deep Bera (Erasmus MC)

Emile Noothout (ImPhys/Acoustical Wavefield Imaging )

Zuyao Chang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Hendrik Vos (ImPhys/Acoustical Wavefield Imaging , Erasmus MC)

Johan Bosch (Erasmus MC)

Martin Verweij (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

Nico De Jong (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

Michiel Pertijs (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Instrumentation
DOI related publication
https://doi.org/10.1109/ULTSYM.2017.8091913 Final published version
More Info
expand_more
Publication Year
2017
Language
English
Research Group
Electronic Instrumentation
Pages (from-to)
1-4
Publisher
IEEE
ISBN (electronic)
978-1-5386-3383-0
Event
2017 IEEE International Ultrasonics Symposium (2017-09-06 - 2017-09-09), Washington, DC, United States
Downloads counter
329

Abstract

This paper presents a front-end application-specific integrated circuit (ASIC) that demonstrates the feasibility of inprobe digitization for next-generation miniature 3-D ultrasound probes with acceptable power- and area-efficiency. The proposed design employs a low-power charge-domain ADC that is directly merged with the sample-and-hold delay lines in each subarray, and high-speed datalinks at the ASIC periphery to realize an additional channel-count reduction compared to prior work based on analog subarray beamforming. The 4.8 × 2 mm2 ASIC, which has a compact layout element-matched to a 5-MHz 150-μm-pitch PZT matrix transducer, achieves an overall 36-fold channel-count reduction and a state-of-the-art power-efficiency with less than 1 mW/element power dissipation while receiving, which is acceptable even when scaled up to a 1000-element probe. The prototype ASIC has been fabricated in a 0.18 μm CMOS process. Its functionality has been successfully evaluated with both electrical and acoustical measurements.