Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging
Fengze Hou (National Center for Advanced Packaging, TU Delft - Electronic Components, Technology and Materials, Chinese Academy of Sciences)
Qidong Wang (Chinese Academy of Sciences)
Min Chen (Chinese Academy of Sciences, Zhejiang University)
Kouchi Zhang (TU Delft - Electronic Components, Technology and Materials)
Jan A. Ferreira (University of Twente)
Wenbo Wang (Shenzhen Institute of Wide-bandgap Semiconductors)
Rui Ma (Chinese Academy of Sciences, National Center for Advanced Packaging)
Meiying Su (Chinese Academy of Sciences, National Center for Advanced Packaging)
Yang Song (National Center for Advanced Packaging, Chinese Academy of Sciences)
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Abstract
In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum package parasitic inductance was found to be about 1.24 nH at 100 kHz. Compared with wire-bonded packages, the parasitic inductances of the PCB-embedded package decreased at least by 87.6%. Compared with blind via structure, the thermal resistance of the proposed blind block structure reduced at most by about 26%, and the stress of the SiC MOSFETs decreased by about 45.2%. Then, a novel PCB-embedded packaging process was developed, and three key packaging processes were analyzed. Furthermore, effect of PCB-embedded package on static characterization of SiC MOSFET was analyzed, and it was found that: 1) Output current of PCB-embedded package was decreased under a certain gate-source voltage compared to SiC die; 2) Miller capacitance of SiC MOSFET was increased thanks to parasitic capacitance induced by package; and 3) compared with SiC die, nonflat miller plateau of the PCB-embedded package extends, and as drain-source voltage increases, the nonflat miller plateau extends. Lastly, switching characteristics of the PCB-embedded package and TO-247 package were compared. The results show that the PCB-embedded package has smaller parasitic inductances.