WW
Wenbo Wang
6 records found
1
Thermal management has always played a significant role in power module design. Double-sided heat dissipation is more efficient at transferring heat than the traditional package. Although there are several thermal modeling approaches to power modules, the application of the numer
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The increased switching frequency and speed of silicon carbide (SiC) MOSFETs lead to higher power density of inverters, but meanwhile resulting in weak electromagnetic interference (EMI). The impedance balance technique is a good way to reduce the common mode (CM) noise by making
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In this article, a novel fan-out panel-level printed circuit board (PCB)-embedded package for phase-leg silicon carbide (SiC) metal-oxide-semiconductor field-effect transistor (MOSFET) power module is presented. Electro-thermo-mechanical co-design was conducted, and the maximum p
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The optimization of mesa etch for a quasi-vertical gallium nitride (GaN) Schottky barrier diode (SBD) by inductively coupled plasma (ICP) etching was comprehensively investigated in this work, including selection of the etching mask, ICP power, radio frequency (RF) power, ratio o
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Gallium nitride (GaN)-based vertical power Schottky barrier diode (SBD) has demonstrated outstanding features in high-frequency and high-power applications. This paper reviews recent progress on GaN-based vertical power SBDs, including the following sections. First, the benchmark
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This paper presents a medium frequency transformer with high insulation level design which is used for the DAB DC-DC converter. The transformer size is largely reduced when operating at medium frequency compared with conventional power frequency transformer which provides the pos
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