A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

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A 0.91mW/Element Pitch-Matched Front-End ASIC with Integrated Subarray Beamforming ADC for Miniature 3D Ultrasound Probes

Conference Paper (2018)

Author(s)

Chao Chen (TU Delft - Electronic Instrumentation)

Zhao Chen (TU Delft - Electronic Instrumentation)

Deep Bera (Erasmus MC)

Emile Noothout (ImPhys/Acoustical Wavefield Imaging )

Zu-Yao Chang (TU Delft - Electronic Instrumentation)

Mingliang Tan (TU Delft - Electronic Instrumentation)

Hendrik J. Vos (Erasmus MC)

Johan G. Bosch (Erasmus MC)

Martin D. Verweij (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

Nico de Jong (Erasmus MC, ImPhys/Acoustical Wavefield Imaging )

Michiel A. P. Pertijs (TU Delft - Electronic Instrumentation)

Research Group

Electronic Instrumentation

DOI related publication

https://doi.org/10.1109/ISSCC.2018.8310246

Imaging Transducers Array signal processing Clocks Three-dimensional displays Ultrasonic imaging Probes

To reference this document use:

https://resolver.tudelft.nl/uuid:98776cf4-cd24-4deb-86f0-8ac2c7b21120

More Info

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Publication Year

2018

Language

English

Research Group

Electronic Instrumentation

Pages (from-to)

186-188

ISBN (print)

978-1-5386-2227-8

ISBN (electronic)

978-1-5090-4940-0

Event

65th IEEE International Solid-State Circuits Conference, ISSCC 2018 (2018-02-11 - 2018-02-15), San Francisco, United States

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Abstract

Data acquisition from 2D transducer arrays is one of the main challenges for the development of emerging miniature 3D ultrasound imaging devices, such as 3D trans-esophageal (TEE) and intra-cardiac echocardiography (ICE) probes (Fig. 10.5.1). The main obstacle lies in the mismatch between the large number of transducer elements (103 to 104) and the limited cable count (<;200). Recent advances in transducer-on-CMOS integration have enabled the use of in-probe subarray beamforming based on delay-and-sum (DAS) circuits [1] to reduce the channel count by an order of magnitude. Further reduction calls for in-probe digitization to enable more advanced data processing and compression in the digital domain. However, prior designs [2-4] compromise on transducer pitch (> half wavelength) to accommodate the ADC and consume >9mW/element, which translates into unacceptable self-heating in miniature 3D probes.

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