Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Journal Article
(2014)
Author(s)
Y. Liu (External organisation)
J.C. Meerwijk (TU Delft - Electronic Components, Technology and Materials)
L Luo (External organisation)
H Zhang (External organisation)
F Sun (External organisation)
CA Yuan (TU Delft - Electronic Components, Technology and Materials)
Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1007/s10854-014-2257-8
To reference this document use:
https://resolver.tudelft.nl/uuid:b1bd5b92-f7e0-4cf1-a4f8-633a13b83a53
More Info
expand_more
expand_more
Publication Year
2014
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
11
Volume number
25
Pages (from-to)
4954-4959
No files available
Metadata only record. There are no files for this record.