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J.C. Meerwijk
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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
Journal article -
Y Liu
,
J.C. Meerwijk
,
L Luo
,
Hang Zhang
,
F Sun
,
C.A. Yuan
,
Kouchi Zhang