Characterization and modeling of mismatch in Cryo-CMOS

Journal Article (2020)
Author(s)

P. A. Hart (TU Delft - OLD QCD/Charbon Lab)

M Babaie (TU Delft - Electronics)

Edoardo Charbon-Iwasaki-Charbon (École Polytechnique Fédérale de Lausanne)

Andrei Vladimirescu (Institut Supérieur d’Electronique de Paris,, University of California, TU Delft - OLD QCD/Charbon Lab)

Fabio Sebastiano (TU Delft - (OLD)Applied Quantum Architectures)

Research Group
OLD QCD/Charbon Lab
Copyright
© 2020 P.A. 't Hart, M. Babaie, E. Charbon-Iwasaki-Charbon, A. Vladimirescu, F. Sebastiano
DOI related publication
https://doi.org/10.1109/JEDS.2020.2976546
More Info
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Publication Year
2020
Language
English
Copyright
© 2020 P.A. 't Hart, M. Babaie, E. Charbon-Iwasaki-Charbon, A. Vladimirescu, F. Sebastiano
Research Group
OLD QCD/Charbon Lab
Issue number
1
Volume number
8
Pages (from-to)
263-273
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Abstract

This paper presents a device matching study of a commercial 40-nm bulk CMOS technology operated at cryogenic temperatures. Transistor pairs and linear arrays, optimized for device matching, were characterized over the temperature range from 300 K down to 4.2 K. The device parameters relevant for mismatch, i.e., the threshold voltage and the current factor, were extracted, from which the change in both absolute value and variability as a function of temperature and device size were investigated. It is shown that the Pelgrom scaling law is valid also at 4.2 K and that the simplified Croon model is able to accurately predict drain-current mismatch from moderate to strong inversion over the entire temperature range. Additionally, the characterization of linear device arrays shows exacerbated edge-effects at extremely low temperatures, thus requiring the addition of dummy devices at the array boundary. The result of this study is the first model capable of predicting mismatch over a wide range of operating regions and temperatures.