Improvement of material properties by employing external RF substrate bias during a-Si:H deposition by a remote expending thermal plasma

Conference paper (2005)

Authors

AHM Smets External organisation
AMHN Petit Electronic Components, Technology and Materials - EEMCS
V Nadazdy Electronic Components, Technology and Materials - EEMCS
WMM Kessels External organisation
R.A.C.M.M. van Swaaij Electronic Components, Technology and Materials - EEMCS
MCM van de Sanden External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2005

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials