Improvement of material properties by employing external RF substrate bias during a-Si:H deposition by a remote expending thermal plasma
Conference Paper
(2005)
Author(s)
AHM Smets (External organisation)
AMHN Petit (TU Delft - Electronic Components, Technology and Materials)
V Nadazdy (TU Delft - Electronic Components, Technology and Materials)
Wilhelmus M.M. Kessels (External organisation)
René A.C.M.M. van Swaaij (TU Delft - Electronic Components, Technology and Materials)
MCM van de Sanden (External organisation)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:f038a3cf-2759-439b-96a6-4192b610fe35
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Publication Year
2005
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1639-1642
ISBN (print)
3-936338-19-1
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