Title
Warpage analysis on power module ceramic substrates
Author
Wang, Chieh (TU Delft Electrical Engineering, Mathematics and Computer Science)
Contributor
Poelma, René H. (mentor)
Hu, D. (mentor)
Zhang, Kouchi (mentor)
Manzaneque Garcia, T. (graduation committee)
Degree granting institution
Delft University of Technology
Programme
Electrical Engineering
Date
2023-08-31
Abstract
This study deals with the challenge of warpage in power modules, vital components in the rapidly expanding electric and hybrid-electric vehicle industry. The variations in temperature during manufacturing, resulting in significant warpage changes, contribute to device cracks, delamination, and reduced reliability.
The primary focus is understanding and mitigating the warpage phenomenon in power module substrates. This warpage is induced by thermo-mechanical stresses during the assembly packaging process. The investigation begins by exploring the cause of warpage change by characterizing annealed copper properties and employing 2D finite element model (FEM) analysis. The study identifies plastic strain as the dominant cause of warpage change during process steps. Subsequently, a validated 3D FEM simulation model is developed to replicate practical annealing and sintering processes. Lastly, the project delves into factor analysis to identify critical variables influencing warpage. It underscores that balancing residual copper volume is crucial in warpage reduction. Additive and subtractive manufacturing techniques establish a correlation between the removal of copper volume and warpage reduction.
This project provides comprehensive insights into the manufacturing process of AMB substrate, warpage behavior, and effective strategies for reduction, constructing a solid foundation for future manufacturing and design.
Subject
Power modules
AMB substrate
Warpage
Finite element model
Sintering
Additive technology
Subtractive technology
To reference this document use:
http://resolver.tudelft.nl/uuid:e82c0398-eda2-4dd4-95cb-3137fc4dc91e
Embargo date
2025-08-31
Part of collection
Student theses
Document type
master thesis
Rights
© 2023 Chieh Wang