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Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network
A Thin and Low-Inductance 1200 V SiC MOSFET Fan-Out Panel-Level Packaging With Thermal Cycling Reliability Evaluation
Time-Dependent Dielectric Breakdown of 4H-SiC MOSFETs in CMOS Technology
High-temperature nanoindentation characterization of sintered nano-copper particles used in high power electronics packaging
Entropy generation methodology for defect analysis of electronic and mechanical components-A review
Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints
Stress analysis of pressure-assisted sintering for the double-side assembly of power module
Optimisation of NB-IoT deployment for smart energy distribution networks
Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding
A review on discoloration and high accelerated testing of optical materials in LED based-products
A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps
Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers
Prognostics and health monitoring of electronic system: A review
A PoF and statistics combined reliability prediction for LED arrays in lamps
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