Online Condition Monitoring Methodology for Power Electronics Package Reliability Assessment

Sintering Process Simulation of Ag Nanoparticles by Phase Field Method

Temperature dependent trap characterisation and modelling of silicon carbide MOS capacitor

Training Convolutional Neural Networks with Confocal Scanning Acoustic Microscopy Imaging for Power QFN Package Delamination Classification

ROM-FOM Interface Optimization for Efficient Thermomechanical Simulations of Electronic Components

A Continuously Updated Package-Degradation Model reflecting Thermomechanical Changes at Different Thermo-Oxidative Stages of Moulding Compound

Degradation of silicone-based sealing materials used in microelectronics

Heterogeneous Integration of Diamond Heat Spreaders for Power Electronics Application

Impact of Temperature Cycling Conditions on Board Level Vibration for Automotive Applications

High-temperature creep properties of a novel solder material and its thermal fatigue properties under potting material

Digital Twin-Based Hybrid PHM Framework for Monitoring Package-Level Degradation

Micro-cantilever Bending Test of Sintered Cu nanoparticles for Power Electronic Devices

Microstructure Analysis Based on 3D reconstruction Model and Transient Thermal Impedance Measurement of Resin-reinforced Sintered Ag layer for High power RF device

Silicon carbide-on-insulator thermal-piezoresistive resonator for harsh environment application

Board level vibration test method of components for automotive electronics: State-of-the-art approaches and challenges

In-situ reliability monitoring of power packages using a Thermal Test Chip

Degradation and Failures of Polymers Used in Light-Emitting Diodes

Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects

Outlook: From Physics of Failure to Physics of Degradation

Erratum: The inactivation mechanism of chemical disinfection against SARS-CoV-2: The MD and DFT perspectives(RSC Advances (2020) 10 (40480–40488) DOI: 10.1039/D0RA06730J)