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3D Align overlay verification using glass wafers
Simple optical characterisation for biomimetic micromachined silicon strain-sensing structure
Uncertainty-based Design Optimization of Structures with Bounded-But-Unknown Uncertainties
SOI Digital Accelerometer Based on Pull-in Time Configuration
Robust Wafer-Level Thin-Film Encapsulation (Packaging) of Microstructures (MEMS) using Low Stress PECVD Silicon Carbide
Thermal Actuation for Precision Micro Motion and Positioning
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices
Silicon MEMS for Detection of Liquid and Solid Fronts
Modeling Strategies for Electro-Mechanical Microsystems with Uncertainty Quantification
MEMS monocrystalline-silicon based thermal devices for chemical and microfluidic applications
Silicon Micromachined Vertical Structures for Nanoparticle Separation
6 DOF Force and Torque Sensor for Micro-manipulation Applications
From MEMS to NEMS: Scaling Cantilever Sensors
Design for Reliability of Wafer Level MEMS packaging
Nonlinear beam mechanics
Hybrid Wafer-Level Packaging for RF-MEMS and Optoelectronic Applications
Ultra thin films for sensing and heating of microprobes
In-Plane Displacement Detection With Picometer Accuracy on a Conventional Microscope
Thermal management of solid state lighting module
Development of Nanotools for Applications in (sub-)Femtofluidics and Graphene Technologies
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